Menu

Executive Programs

Workshops

Projects

Blogs

Careers

Placements

Student Reviews


For Business


More

Academic Training

Informative Articles

Find Jobs

We are Hiring!


All Courses

Choose a category

Loading...

All Courses

All Courses

logo

Loading...
Executive Programs
Workshops
For Business

Success Stories

Placements

Student Reviews

More

Projects

Blogs

Academic Training

Find Jobs

Informative Articles

We're Hiring!

phone+91 9342691281Log in
  1. Home/
  2. Shaik Faraz/
  3. Week 6 - CHT Analysis on a Graphics card

Week 6 - CHT Analysis on a Graphics card

Aim: Perform a steady-state conjugate heat transfer analysis on a model of a graphics card. You can use appropriate materials of your choice for the simulation. Make sure to properly define the correct solid and fluid zones. Refer the video for further clarification and the model is provided below the video. Run the simulation…

    • Shaik Faraz

      updated on 16 Oct 2022

    Aim:

    Perform a steady-state conjugate heat transfer analysis on a model of a graphics card. You can use appropriate materials of your choice for the simulation. Make sure to properly define the correct solid and fluid zones. Refer the video for further clarification and the model is provided below the video.

    Run the simulation for best possible mesh with combination of coarse and refined mesh in different regions. Explain the reason for choosing the particular mesh settings. 

    Objectives:

    1. Run the simulation by varying the velocity from 1m/sec to 5m/sec for at least 3 velocities and discuss the results.
    2. Find out the maximum temperature and heat transfer coefficient attained by the processor.
    3. Prove that the simulation has achieved convergence with appropriate images and plots.
    4. Identify potential hotspots on the model.

    Introduction:

    Graphic Card or GPU is an electronic component often a computer's pepheral, responsible for computing the graphic signals, later transmitted to a graphic device. It has various range of performance as well as power usage. based on the design, the power rating is often specified on the package, the gpu may have a power rating of over 50W to 2000W. Many system architectures prefer modular gpu's for better power and accordingly heat management. 

    Outline study:

    Conjugate heat transfer simulation has been done to achieve the objective. Since the study is of computational in nature, mesh refinement is a compulsory task. Mesh refinement strategy and study has been discussed in the next section. After mesh refinement the study has been followed up in two cases, as discussed below.

    Case 1:

    Inlet Velocity of 1 m/s is to be applied at the inlet boundary.

    Since the velocity is the least among all the cases, less cooling is expected in this case. Heat transfer coefficient and maximum temperature has to be calculated in this case.

     

    Case 2:

    Inlet Velocity of 5m/s is to be applied at inlet boundary.

    Since the velocity is increased further, the best performance among the three case is expected. Also, the velocity increase will lead to turbulent effect which can drastically affect the heat transfer. The best performance is expected in this case.

     

    Geometry & Assumptions:

    The geometry considered for the current study is a simplified model of the graphics card. The entire card can be classified into three major regions:

    1) base of the card

    2) processor

    3) fins

    The base of the card includes everything on the card except the processor and cooling component fins. The base is made steel which is the most commonly used materials for designing PCB. The processor will act as the energy source because of the heat generated due to the supply of the electrical power and is assumed to be made of silicon (there is no silicon data in fluent database in my licence hence i have made silicon by giving data). The fins provide convective cooling to the processor so that there are no thermal damages on the graphics card. The fins are assumed to made of standard copper available in Fluent database.

    Here we are going to see a new term volumetric heat sourse. volumetric heat sourse is the energy released in a unit volume at unit second. the energy relased from processor is the power consumpted by the processor, that is the energy relased from the processor is 50w. the dimensions of processor is 8*8*1 mm^3 and the length of the graphic card is 56mm

    so the final volumetric heat sourse is 50/(8*8*1)  W/mm^3 = 781250000 W/m^3. 

    The working fluid which flows in the enclousre for cooling the card is standard air from the Fluent database. The thermodynamical and physical properties of these materials will be discussed in detail in the Case Setup section.

    To solve the Conjugate heat transfer problem, we use the share tool in the Ansys SpaceClaim toolkit, so that we are able to generate conformal mesh. The entire geometry and its components which are discussed above are visualized in the following figures

    Graphics Card:

    Base of the card:

    Processor:

    Fins:

    Note: Enable the SHARE TOPOLOGY

    Mesh refinement:

    In this study, heat transfer from the heat generating Unit (Processor) will get dissipated by 2 methods, conduction via fins and base plate and convection by air, since the effect of radiation has not been taken into account.

    The geometries carrying the heat away from the processor are fins, base plate and vicinity fluid in these two media combined with fluid in contact with processor. Mesh refinement has been approached by changing the body sizing of these geometries.

    First simulation is taken for base mesh and no changes are made in base mesh. But for the second simulation the mesh is refined and body sizing is implemented for parts of geometry

    BASE MESH:

    Quality:

    Element no:

     

     

    SET UP:

    • set up physics
    • check energy eq.
    • select k omega turbulent model
    • create materials both solid and fluid
    • air for fluid
    • steel, copper and silicon for solid
    • add materials for cell zone
    • create boundary layers and add shell conduction
    • layer trhickness 0.001 and thermal conduction 10
    • select materials for wall
    • between solid and fluid material will be of solid
    • between 2 solids it will be of the solid which has no source
    • add source for processor wall ie., 781520000
    • initialize
    • create plane on zx axis and make 2 contour of temperature and velocity
    • create a point on processor for creating a vertex average temperature and note co-ordinate for other simulation
    • start simulation and compare results for different simulation

     

     

    Case 1: 1 m/s

     

     

    Case 2: 5 m/s

     

     

    REFINED MESH:

    Quality:

    Elements no:

    Case 1: v = 1 m/s

     

     

     

     

    Case 2: v = 5 m/s

     

     

     

     

     

     

     

     

    Conclusions:

    From the above plots and contours we note the following observations and conclusions:

    1. Residuals do not provide information on the convergence to the steady state of the flow.
    2. The temperature monitor from above cases reach a steady state value and proves to be a great indicator of the convergence of the steady state problem.
    3. As the velocity decreases, we observe that the thermal hot-spots are much stronger in magnitude and have an impact on larger regions of the graphic car. This observation is inline with the theoritical expectation of the effects of the convective heat transfer.
    4. The heat transfer coefficient near the fins is highest for inlet velocity of 5m/s. This observation is inline with the experimental trend. 

    Leave a comment

    Thanks for choosing to leave a comment. Please keep in mind that all the comments are moderated as per our comment policy, and your email will not be published for privacy reasons. Please leave a personal & meaningful conversation.

    Please  login to add a comment

    Other comments...

    No comments yet!
    Be the first to add a comment

    Read more Projects by Shaik Faraz (27)

    Project 1 : CFD Meshing for Tesla Cyber Truck

    Objective:

    Aim: Performing topological cleanup and surface mesh on tesla cyber truck and on a wind tunnel based on selected target length values of its different components using element type as Tria, as well as appropriate selection of the volume that contains the vehicle and its surroundings with the wind tunnel for volumetric…

    calendar

    15 Nov 2022 04:17 AM IST

    • ANSA
    • CFD
    Read more

    Week 5 Challenge : Surface wrap on Automotive Assembly

    Objective:

    Aim: Perforform Topo cleanup and delete unwanted surfaces for Surface wrap. After Topo cleanup, Merge all 3 models and perform surface wrap. Target length for Wrap = 3 mm   1. Engine:    2. Gear box:   3. Transmission:   Procedure: 1. Topo Cleanup : (Engine, Transmission & Gear Box)…

    calendar

    10 Nov 2022 08:22 AM IST

      Read more

      Week 4 Challenge : CFD Meshing for BMW car

      Objective:

      Aim: To perform topological clean-up, and carry out the surface meshing of a BMW M6 car model and create a wind tunnel surrounding the same. Objectives: For the given model, check and solve all geometrical errors on half portion and Assign appropriate PIDs. Perform meshing with the given Target length and element Quality…

      calendar

      07 Nov 2022 11:33 AM IST

        Read more

        Week 3 Challenge : CFD meshing on Turbocharger

        Objective:

        Aim: Performing CFD meshing on Turbocharger using ANSA Objective: For the given model, check for the geometrical errors to make appropriate volumes. Create and assign PIDs as shown in the video. Perform surface mesh with the given target lengths as per PIDs. Blade stage-1 = 1 mm Blade stage-2 = 1 mm Impeller = 2 mm…

        calendar

        03 Nov 2022 08:06 AM IST

        • ANSA
        • CFD
        Read more

        Schedule a counselling session

        Please enter your name
        Please enter a valid email
        Please enter a valid number

        Related Courses

        coursecardcoursetype

        Accelerated Career Program in Embedded Systems (On-Campus) - Powered by NASSCOM

        Recently launched

        0 Hours of Content

        coursecard

        5G Protocol and Testing

        Recently launched

        4 Hours of Content

        coursecard

        Automotive Cybersecurity

        Recently launched

        9 Hours of Content

        coursecardcoursetype

        Pre-Graduate Program in Bioengineering and Medical Devices

        Recently launched

        90 Hours of Content

        coursecardcoursetype

        Pre-Graduate Program in 5G Design and Development

        Recently launched

        49 Hours of Content

        Schedule a counselling session

        Please enter your name
        Please enter a valid email
        Please enter a valid number

                    Do You Want To Showcase Your Technical Skills?
                    Sign-Up for our projects.